Diffusion Bay

IPEC/Westech Model 372M CMP System
The system is fully automated. It is capable of handling 4” and 8” wafers. Features automatic loading/unloading, and is capable of two-step polishing processing.

Suitable for:
1) CMP processing of oxide and other dielectrics (HiK), and in a near futur tungsten and copper
2) Silicon and SOI polishing
3) MEMs processing

Compatible cleaning systems are available with this equipment.

Recommended slurries from Dupont: (look also for other slurries at http://www.nanoslurry.com/products.htm)
1) Si wafer polish: Syton HT-50 Colloidal Silica slurries
2) SiO2: Syton OX-K Colloidal Silica Slurry
3) STI: Microplanar STI2100
4) W: Microplanar CMP3700
5) Cu: CoppeReady Cu3900
6) Barrier products: Cu405
Operating Procedure

Polishing Procedure

1. Turn On Facilities (Vacume, CDA, N2, Water)
2. Power ON
3. Turn spindle on
4. Initialize (If system does not initialize, contact maintenance at mertech.mer.utexas.edu)
5. Push [Select Screen]
6. Push [Manual Operation[
7. Push [Manual Load/Unload]
vv for more wafers: Push [Move Load]
8. Move Load Position
9. Load wafer > Find center point
10. Push [Load Wafer]
11. Push [RET]
12. Push [Primary Polish A]
13. When complete: Push [Manual Load/Unload]
vv for more wafers: Push [Move Load]

Catch the wafer being unloaded

Repeat Steps 7-13

Continue to the Flushing Procedure

Flushing Procedure

14. When finished polishing and wafer is removed
15. Push [RET]
16. Push [Select Screen]
17. Push [POL CTRL]
18. Remove Hose from Slurry and Insert into Water
19. Push [SLURY 1 TEST]
20. Enter [200]
21. Push [SAVE]
22. Allow to flush until dispensing clear fluid (approximately 2 min.)
23. Push [OFF]
24. Push [EXIT]
25. Push [Select Screen]
26. Push Button [Spindle Off]
27. Push Button [Power Off]
28. Turn off Facilities (Vacume, Clean Dry Air, Nitrogen, Water Valves)

To add compatibility specifications or to report problems with this equipment, please email: mertech@mer.utexas.edu.