III-V Etch Bay

Trion Oracle: Plasma Etch
Location: 1.750
*****
*****Description: RIE Etcher

****Features: Central Vacuum Transport
**xxxxxxxxxx*reactor 1: CF4, SF6, O2, Argon, N2, CHF3, Helium, only full size wafer can be loaded
**xxxxxxxxxx*reactor2: SO2, O2, CO2, Argon, N2, C2H6, Helium, only full size wafer can be loaded
**xxxxxxxxxxxxxxxxxx*Chuck with Helium back side cooling (-30°C), ICP head on chamber 2
**xxxxxxxxxx*reactor 3: Cl2, Helium, CF4, N2 (for purge only, high flexibility for sample size)
**xxxxxxxxxx*Turbo pump on each chambers

*****Compatible Materials: IMPRIO related project

*****Incompatible Materials: Metals other than chrome
The Oracle cluster system consists of two components:
1) Central Vacuum Transport (CVT)
2) 3 “roll-away” process reactors

The “roll-aways” are docked to the CVT in a cluster configuration.
The system is configured with single wafer loading or for full production with vacuum cassette elevators.