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Step and Flash Imprint Lithography IMPRIO 100
The Step and Flash Imprint Lithography (SFIL) from Molecular Imprints, IMPRIO 100, is a high resolution “molding” system.
The SFIL concept is based on a quartz template (the mold) and low viscosity fluid. The template is created by etching patterns into quartz previously EBL writing. The low viscosity fluid, dispensed by the IMPRIO 100 fills the cavities.
If UV cure, this fluid turns into a polymer (the etch barrier). The SFIL technique is capable to replicate complex patterns in multilayers polymers, as small as 40nm (features size of the pattern profiles after etching).
The etching process takes place after the imprint steps to transfer the patterns into various sublayers (SiO2, Si, SiN,…)
Features: Template (1 x mold, thick patterned and etched back quartz substrate)
Active field centered into the template –Mesa- max size : 30x40mm2
Wafer holder sizes available: 2", 4", 8" - Double-sided polished wafer
Wafer size: 8", 6", 4", 2" (no pieces)
Chemicals: monomers dispensed via nanoliter piezopump (etch barrier) with Si or non Si containing material
CD Uniformity: 3s <15nm
Overlay: 3 sx<500nm, 3 sy<500nm
Special Care: No solvents to clean the Stage. Use DI water or dilute IPA.
Be sure that He is turned on before imprinting.
1. Substrate preparation: Coat wafer with BARC transfer layer ( 5DUV30J, Brewer Science), 55-60nm. To improve the imprinting regarding wetting and adhesion performance of the imprint material to the underlying substrate.
2. Surface treatment of the template: Clean template with IPA. The template is coated with RealMat a release layer to
reduce the template’s adhesion of MonoMat. To reclaim the template do a Piranha clean.
3. Load template, level template (manual process).
4. Load coated wafer, level wafer
5. Alignment correction in each field in case of patterned/ etched wafer.
6. Dispense MonoMat (non-Si containing monomer for SFIL-R process) on one field (size of the mesa), imprint and expose with UV. The MonoMat is dispensed from the IMPRIO via a nanoliter piezopump. This step will be repeat in order to have fully imprinted wafer.
7. Unload wafer. IMPRIO process is done
8. The imprinted substrate is spin coated with a Silicon-containing polymer (220nm SilSpin) to planarize the structure.
9. The SFIL Plasma etching process segmented into 3 steps:
• SilSpin etch back
• SilSpin Oxidation
• BARC transfer layer etch