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NNIN/MRC Workshop

Fabrication of sub-100nm features with imprint lithography covering a full wafer

March 10th-11th, 2009

 Microelectronics Research Center at JJ Pickle Campus
 10100 Burnet Road, Bldg # 160,
Austin, Texas 78758

 

Abstract:

The International Technology Roadmap for Semiconductors (ITRS) has identified several technologies as candidates for future advanced lithography. One of these techniques is the nano-imprint lithography (NIL). The NIL technique performed at MRC is Step and Flash Imprint Lithography (S-FIL™). S-FIL is based on a low viscosity fluid that fills in the cavities of a mold (a 1:1 high resolution quartz mold with features written with Electron-Beam lithography). After UV cure, the mold features are locked onto the substrate with that polymer and are transferred onto the under-layer by successive etching steps.

S-FIL has proven capabilities of forming various geometries including lines, posts, holes, and 3-dimensional tiered structures. The ability to imprint arbitrary geometries has allowed S-FIL to be applied to a number of applications like for example, in biomedicine, optics, magnetic storage,….

In this two days workshop, an introduction to process steps involved in S-FIL (Photolithography, Etching) will be given with lectures. During the two hands-on sessions, attendees will do lab practice by imprinting on IMPRIO100 from Molecular Imprints Inc. as well as by dry etching for transferring sub-100nm imprint patterns into substrate. We will learn how to transfer holes and pillars from the same template by utilizing two imprint resists (A non-Si non-containing monomer and a Si-containing monomer) following by adequate etching processes.

Contacts

Marylene Palard, NNIN MRC program manager, marylene@mer.utexas.edu, (512) 658 2668

Jean L. Toll, Executive Assistant, j.toll@mer.utexas.edu, (512) 471-4493

 

Speakers

Chris Mack, Professor at the Department of Electrical & Computer Engineering, College of Engineering, UT Austin, chris@lithoguru.com

Chris Jones, Applications Engineer from Molecular Imprints Inc. CJones@molecularimprints.com

Fee

One hundred fifty dollars per person ($150)


Tentative Schedule:

 

Tuesday March 10th, 2009

8:00-8:05

Welcome by the MRC Director

Sanjay K Banerjee

MRC Director

8:05-8:10

Review of the day schedule and presentation of the workshop staff members

Marylene Palard

 

8:10-9:10

First part lecture on nano-IC Fabrication

Chris Mack, Professor at UT

9:10-9:20

Coffee Break (assign group n° and bunny suit size)

 

9:20-10:20

Second part lecture on nano-IC Fabrication

Chris Mack, Professor at UT

10:20-10:30

Coffee Break

 

10:30-11:30

Overview of the Step and Flash Imprint Lithography techniques and applications

C Jones Molecular Imprints Engineer

11:30-12:30

Lunch Break.

 

12:30-13:00

Hands-on session description

Marylene Palard

13:00-14:30

15:00-16:30

Imprinting with SFIL, IMPRIO100

Template 10mmx10mm Mesa with 100nm features

Si-Monomat for etch barrier

Gabriel Glenn

Jesse James

 

14:30-15:00

Break

 

13:00-14:30

15:00-16:30

Etching

Etch barrier thickness measurement onto Mesa, with Nanospec AFT, recipe 331

Etch barrier + transfer layer + Si etch on RIE Plasma Therm n°2,

SEM analysis

Johnny Jonhson,

Marylene Palard

16:30-17:00

Questions

 

 

Wednesday March 11th, 2009

8:30-10:30

SEM analysis on Zeiss Neon40

Marylene Palard

Ricardo Garcia

10:30-11:30

Etching or  Imprinting in IMPRIO100

 

Johnny Jonhson,

Gabriel Glenn

Jesse James

11:30-12:00

Conclusion of the workshop and Survey

 

 

According to the number of attendees to the workshop we will have maximum 2 groups of maximum 5 persons each.

Each group will go trough all the process steps, by rotation, during the afternoon hands-on session in the cleanroom.

 

Imprinting, South Cleanroom

Group 1

Group 2

Etching, North Cleanroom

Group 2

Group 1


DOWNLOAD EVENT REGISTRATION FORM

Last modified: Febuary 2, 2009.
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Department of Electrical & Computer EngineeringCollege of Engineering
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