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Etcher ICP 2300 Exelan Flex LAM

Equipment Type: 
Silicon Etch
Equipment Area: 
North Cleanroom
Equipment Location: 
1.750
Description: 

LAM etcher with 12 gas lines is designed for use with 300 mm wafers. This equipment sustains the activities on nano-patterning transfer capability and specially block co-polymers, graphene and shaped nanostructures etching.

Gases: 
C4F8, CF4, O2, Ar, CO, CO2, O2, CHF3, HBr, N2, SF6, H2
Compatible Materials: 
TBD