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Etcher ICP Oxford 100

Equipment Type: 
III-V Etch
Equipment Area: 
North Cleanroom
Equipment Location: 
1.750
Description: 

Description: ICP Etcher

Features: 6 inch wafer load arm (for pieces, use carrier wafer)

Gases: 
HBr, Cl2, BCl3, CH4, SF6, and SiCl4 O2, Ar, N2, H2
Compatible Materials: 
III-V
Incompatible Materials: 
Metals