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Etcher RIE Oxford 80
Description: RIE Etcher
Features: up to 8" wafers
chamber gases: CH4, N2, H2, Ar, CHF3, Cl2, SF6, Ar
cold chuck (-15°C)
turbo pump
Compatible Materials:
Si / SiGe / Polymer
© 2013 Microelectronics Research Center | Department of Electrical and Computer Engineering | The University of Texas at Austin