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Etcher RIE Oxford 80

Equipment Type: 
Silicon Etch
Equipment Area: 
North Cleanroom
Equipment Location: 
1.750
Description: 

Description: RIE Etcher

Features: up to 8" wafers
chamber gases: CH4, N2, H2, Ar, CHF3, Cl2, SF6, Ar
cold chuck (-15°C)
turbo pump

Compatible Materials: 
Si / SiGe / Polymer