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Etcher Trion Oracle

Equipment Type: 
Silicon Etch
Equipment Area: 
North Cleanroom
Equipment Location: 
1.750
Description: 

RIE/ ICP Etcher

Features: Central Vacuum Transport for a full 25 wafer lot
Up to 8inch wafer
Only full size wafer can be loaded. Make sure to place your pieces /coupons on a carrier wafer.
Reactor #2, Chuck with Helium back side cooling (-30°C), ICP head.
Turbo pump on each chambers

RIE quartz etch in Trion Chamber #3
CF4=15sccm
He=40sccm
130W
15mTorr
rate: 30nm/min.

RIE Chrome etch in Trion Chamber #3
Cl2=40sccm
O2=10sccm
80W
30mTorr
rate: 6nm/min

Gases: 
reactor 1: CF4, SF6, O2, Argon, N2, CHF3, He reactor2: SO2, O2, CO2, Argon, N2, C2H6, He reactor 3: Cl2, He, CF4, He, O2
Compatible Materials: 
IMPRIO related project
Incompatible Materials: 
Metals other than chrome
Procedures: 

The Oracle cluster system consists of two components:
1) Central Vacuum Transport (CVT)
2) 3 “roll-away” process reactors

The “roll-aways” are docked to the CVT in a cluster configuration.
The system is configured with single wafer loading or for full production with vacuum cassette elevators.