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Rapid Thermal Anneal Silicon -Allwin 610 -

Equipment Type: 
Diffusion
Equipment Area: 
North Cleanroom
Equipment Location: 
1.756A
Description: 

Rapid Thermal Process.
 
Features: Chuck Holder 4", Wafer Size up to 4". 
 
N2 flow. Pyrometer
 
Process time: 
450°C max 1 hour
900°C max 10 minutes
1000°C max 5 minutes
1100°C max 2 minutes
1150°C max 60 seconds
 

Gases: 
N2, NO (nitric oxide, nitrogen monoxide), NH3, O2
Compatible Materials: 
Si
Incompatible Materials: 
Metals
Procedures: 

1.) Log on the Tool Using the LabAccess Termina